Polyamide Hot Melt Glue Granules (BS-G705)

The BS – G705 Polyamide Hot Melt Glue Granules are engineered for robust, flexible bonds, these thermoplastic gems are essential in shoemaking and leather goods. From thermofolding to insole binding, trust these granules for professional results.

 

Description

Chemical Nature: Copolyimide

Physical Specifications:

  • Softening Point (R&B): 100 – 110 °C
  • Viscosity at 160°C: 3800-4800 mPa.s
  • Specific Gravity: 0.98 g/cm³
  • Color: Transparent Amber

Mechanical Specifications:

  • Maximum Load: 10 N/mm²
  • Ultimate Elongation: 15%
  • Modulus of Elasticity: 250 N/mm²

Other Typical Specifications:

  • Setting Time: Fast
  • Work Temperature: 145 – 155 °C

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